Global Unichip Corp. (GUC), a leader in semiconductor ASIC solutions, launched of its next-generation 2.5D/3D Advanced Packaging Technology (APT) platform, manufactured in order to accelerate design cycles as well as reduce risk for high-performance, high-yield ASICs. The platform connects TSMC’s latest 3DFabric® technologies with advanced process nodes, enable next-generation desi... https://www.coherentmarketinsights.com/news/guc-introduced-next-generation-25d3d-apt-platform-1586